Categories
środki mocujące do ciśnieniowego inkludowania próbek

Compression mounting compounds

211.09€ 439.63€Price range: 211.09€ through 439.63€

A range of thermosetting compression mounting compounds for hot compression mounting. EpoMet® G is a high hardness, hot mounting epoxy with good edge retention and low shrinkage. EpoMet F is similar to EpoMet G, with very low shrinkage and a finer grain size. ProbeMet® is a fine-grained hot mounting epoxy resin containing copper. The extra fine particles fill small voids and cavities. It has near zero electrical resistance and is ideal for conductive SEM, EDS, WDS, and microprobe analysis. ProbeMet has superior edge retention and good hardness. 1.84 kg per pack.

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Variant Code Net price Gross price Quantity Availability
EpoMet G Moulding Powder (1.85kg) AGB8784 228.65€ 281.24€
EpoMet Fine Grain Moulding Powder (1.85kg) AGB8784F 211.09€ 259.64€
ProbeMet Conductive Moulding Powder (1.85kg) AGB8785 439.63€ 540.75€
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